Process Engineering Technician (Plating) (50356)
Company: Headway Technologies
Location: Milpitas
Posted on: April 1, 2026
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Job Description:
Description TITLE: PLATING PROCESS TECHNICIAN FLSA STATUS:
NON-EXEMPT A SHIFT: MONDAY TO WEDNESDAY AND EVERY OTHER
THURSDAY,6:00AM-6:00PM REPORTS TO: DIRECTOR, PLATING PROCESS
ENGINEERING SUMMARY: Under the direction of the Manager of Plating
Process Engineering, the Plating Process Technician provides
support to the engineering teams in the plating area, including
assisting with wet etch process, preparing and maintaining recipes,
reviewing and documenting process or procedures, and expediting and
dispositioning prototype wafers; maintains process controls using
Statistical Process Control (SPC), collects and analyzes data, and
recommends corrective action. This position is located in Milpitas,
California. ESSENTIAL FUNCTIONS: Provides support to the
engineering teams in the plating, wet etch, and stripping process
areas Supports the plating, wet etch, and stripping processes by
preparing, maintaining, and setting up recipes to ensure an
efficient and consistent process Reviews and documents processes
and procedures; partners with engineering to implement changes
effectively Expedites and dispositions prototype wafers in the
plating, wet etch and stripping areas Assists engineers to run
plating process development experiments, collects and analyzes
data, and recommends corrective action if required Reviews and
maintains process controls using SPC and prepares charts and graphs
Assists with routine troubleshooting and resolves basic
process-related issues Participates in and recommends modifications
to procedures or processes in support of continuous improvement
initiatives Collaborates with Engineering to qualify or approve new
processes or procedures Creates reports, charts, or graphs on an
ad-hoc or routine basis Prepares daily pass down report for
engineers, next shift plating process technicians, and
manufacturing plating technicians Responds to inquiries from other
team members, managers, or departments Adheres to all safety
policies and procedures as required Performs other duties of a
similar nature or level* Qualifications MINIMUM QUALIFICATIONS:
Associates degree in Electronics or Industrial Technology and/or
equivalent relevant experience Two years of experience working in
the semiconductor industry Knowledge of plating, wet processes and
procedures Hands on experience using metrology tools such as pH
meter, Tencor Thickness Profiler, XRF, and B-H loop tools
Proficient in the use of Microsoft Office Applications Required
Knowledge, Skills, and Abilities: Knowledge of semiconductor or
hard disk drive (HDD) principles and processes Knowledge and
ability to use SPC to maintain process controls Knowledge of
plating, wet processes and procedures Ability to collect and
analyze data, present findings, and recommend corrective action
Ability to adhere to all safety policies and procedures Ability to
communicate effectively with all levels of employees and management
Demonstrated ability to follow routine verbal or written
instructions Demonstrated problem solving and organizational skills
Demonstrated time management and prioritization skills Skilled at
resolving issues quickly and efficiently Flexible and able to
prioritize The hourly rate for this full-time position is between
$26.00-$35.00 bonus target benefits. Within the range the
individual pay may differ depending on additional factors including
job responsibilities, job related knowledge, skills, abilities,
education, and experience. The hourly pay range shown is subject to
change and may be modified periodically. WORKING CONDITIONS: The
Plating Process Technician works primarily in an indoor environment
on a rotating schedule (A, B, C, or D shift). The schedule may be
altered from time-to-time to meet business or operational needs;
may travel from building-to-building as needed. Works in a class
100 ESD sensitive wafer manufacturing facility; wears a cleanroom
(bunny) suit, including hood, gloves, safety glasses, booties, and
mask. May be exposed to hazardous conditions, chemicals, fumes,
and/or gases during the course of workday; Stands and walks;
performs various fine grasping movements, bends, and twists;
operates a computer and enters information using a keyboard,
operates a telephone, and other office equipment. Must be able to
load and unload various wet etch chemical solutions several times
per shift. May be required to push, pull, or lift up to 25 pounds.
*Other duties of a similar nature or level are duties that may be
required but may not be specifically listed in the job description
or posting. TDK/Headway Technologies, Inc. provides equal
employment opportunities (EEO) to all employees and applicants for
employment without regard to race, color, religion, gender,
national origin, age, disability, or genetics. Applicants requiring
accommodation in order to complete the application process should
contact the Headway Human Resources Department.
Keywords: Headway Technologies, Vallejo , Process Engineering Technician (Plating) (50356), Engineering , Milpitas, California